Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of $252.5 bil. in total investment

An industrywide 392 trillion-won ($252.5 bil.) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics and SK hynix, as part of the government's drive to spread artificial intelligence (AI)-led growth, the industry ministry said Thursday. It is a follow-up plan to the government's tripolar mega projects, unveiled by President Lee Jae Myung earlier this week, aimed at advancing technologies across the country and turning Korea into an industrial powerhouse in the emerging AI era. According to the Ministry of Trade, Industry and Resources, Samsung Group pledged to invest a total of 140 trillion won in Chungcheong Province to build an HBM fab and packaging facility by Samsung Electronics, as well as an organic light-emitting diode and next-generation display production line by Samsung Display. Samsung Electro-Mechanics will construct high-performance package substrate facilities for AI servers and Samsung SDI will build an advanced battery manufacturing factory. Samsung Group expects the invest